ATHENA_ELITE : 2-D Topography Simulation

• anelex01.in : Deposit Machine Comparison
• anelex02.in : Unidirectional Deposit Example
• anelex03.in : Trench Etching: A Simple Approach
• anelex04.in : Trench Etching Using the RIE Model
• anelex05.in : Microloading Effects
• anelex06.in : Comparison of RIE Model Components
• anelex07.in : Effect of Beam Divergence on Etch Rates
• anelex08.in : Trench Etch Tuning using RIE Model
• anelex09.in : Trench Filling and Planarization
• anelex10.in : Ion Milling of Aluminum
• anelex11.in : Two-Step Trench Etch Process
• anelex12.in : Lift-off Profile Polymer Etching
• anelex13.in : Interconnect Metallization
• anelex14.in : MOS LDD Spacer Formation
• anelex15.in : Metal Passivation
• anelex16.in : Intermetal Dielectric Formation
• anelex17.in : Custom Deposit
• anelex18.in : Trench Etch
• anelex19.in : Contact Etch, Reflow, and Metallization
• anelex20.in : Sticking Coefficient for Monte Carlo Deposit
• anelex21.in : Surface Diffusion for Monte Carlo Deposit
• anelex22.in : Monte Carlo Deposit into Contact Cut
• anelex23.in : Monte Carlo Deposit on Sloped Sidewall
• anelex24.in : Customizable Deposit from an ASCII File
• anelex25.in : The Hard Polish Model
• anelex26.in : The Soft Polish Model
• anelex27.in : Hard and Soft Pad Modeling Using the Soft Polish Model
• anelex28.in : Multi-layer CMOS structure
• anelex29.in : Simple Plasma Etched Trench with Sidewall Implant
• anelex30.in : Dopant Concentration Enhanced Etch Rate
• anelex31.in : Oxidation Induced Stress Enhanced Etch Rate
• anelex32.in : Metal Void Formation
• anelex33.in : Polymer Redeposition Effect
• anelex34.in : Polymer Etch Rate and Reflection Effect
• anelex35.in : Effect of Plasma Characteristics