发表论文  

发表论文 - 互连

The full text of most of these papers may be found at the IEEE website at www.ieee.org.

T. Nagano, S. Kimura and J. Onuki "Impact of Cu local interconnect on LSI performance"
Materials Transactions, Volume 43, Jul. 2002, Pages 1574 - 1576.

Bermond, C et al "Characterization of dual damascene Cu-SiO sub 2 interconnects in time and
frequency domains" Advanced Metallization Conference 2000 (AMC 2000); pp 19-24

R. R. Song, G. Ruan, X. Xiao, R. Streiter, T. Otto and T. Gessner, "Geometrical optimizing design
of interconnection for deep sub-micrometer VLSI circuits (in Chinese)" Research & Progress of
Solid State Electronics, Volume 20, No.1, 2000, pp. 84-93.

Bermond C. Flechet B. Le Carval G. Charlet F. Morand Y.Angenieux G Salik R. "Performance
Characterization of Advanced Interconnect on High Speed VLSI Circuits" Proc. ESSDERC 2000,
pp. 216-219.

B.Froment et al "Ultra low capacitance measurements in multilevel metallisation CMOS by using a
built-in Electron-meter" IEEE J. SS Ccts, 1999. Chia-Fu Chou et al "Sorting of biomolecules via
microdevices" Proc. IEDM 1999

B.Froment et al "New Interconnect capacitance characterization method for multilevel metal
CMOS processes" Proc. IITC 1999.

C.Bermond et al "Performance Characterization of Advanced Interconects on High Speed VLS
I Circuits" Proc. ESSDERC'99, pp. 216-219.

S.Putot et al "A Fast and Accurate Computation of Interconnect Capacitance" Proc. IEDM Tech.
Dig., 1999, pp. 893-896.

G.LeCarval et al "Advanced Interconnect Scheme Analysis: Real Impact of Technological
Improvements" Proc. IEDM Tech Dig, 1998, pp. 837-840.

I. Kamohara "Statistical simulation methodology for multi-level interconnect contact analysis and
step coverage evaluation" In 1997 2nd International Workshop on Statistical Metrology, 8 June
1997, Kyoto, Japan, pages p.113-

R. Salik, P. Ferrari, A. Chosson, and G. Angnieux "Electrical performance in time domain of
subminiature interconnections on new thin films" Proceeding of the 3rd IEEE International
Symposium on Advanced Packaging Materials, 1997, pp. 143-14

B. Flechet, R. Salik, J. W. Tao, and G. Angenieux "Microwave characterization of thin film
materials for interconnections of advanced packaging" Proceeding of the 3rd IEEE International
Symposium on Advanced Packaging Materials, 1997, pp. 139-14

L. Floyd, M. O'Reilly and A. Mathewson "Delay simulation comparisons between and multilevel
interconnect" Microelectronic Engineering, Volume 33, January 1997, Pages 415-422.